Issued Patents 2021
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195804 | Semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen | 2021-12-07 |
| 11183475 | Semiconductor structure | Jie Chen, Hsien-Wei Chen | 2021-11-23 |
| 11177201 | Semiconductor packages including routing dies and methods of forming same | Jie Chen, Hsien-Wei Chen | 2021-11-16 |
| 11164857 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2021-11-02 |
| 11133304 | Packaging scheme involving metal-insulator-metal capacitor | Hsiang-Ku Shen, Hsien-Wei Chen | 2021-09-28 |
| 11107680 | Mask assembly and method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2021-08-31 |
| 11099916 | Method and device for presenting information on terminal | Tao Guo, Yi Zhong | 2021-08-24 |
| 11081391 | Wafer level dicing method and semiconductor device | Hsien-Wei Chen | 2021-08-03 |
| 11056433 | Redistribution layer structures for integrated circuit package | Jie Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2021-07-06 |
| 11018069 | Underfill control structures and method | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2021-05-25 |
| 10964659 | Semiconductor device | Jie Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2021-03-30 |
| 10943889 | Semiconductor device and method of manufacture | Hsien-Wei Chen, An-Jhih Su, Jie Chen | 2021-03-09 |
| 10923421 | Package structure and method of manufacturing the same | Hsien-Wei Chen, Ming-Fa Chen | 2021-02-16 |
| 10886238 | Supporting InFO packages to reduce warpage | Jie Chen, Hsien-Wei Chen | 2021-01-05 |