Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164848 | Semiconductor structure and method manufacturing the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Chuan-An Cheng | 2021-11-02 |
| 11114413 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2021-09-07 |
| 11107680 | Mask assembly and method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Ying-Ju Chen | 2021-08-31 |
| 11069608 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2021-07-20 |
| 11063019 | Package structure, chip structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2021-07-13 |
| 11063022 | Package and manufacturing method of reconstructed wafer | Ming-Fa Chen, Chao-Wen Shih, Hsien-Wei Chen, Sung-Feng Yeh | 2021-07-13 |
| 11056438 | Semiconductor packages and method of forming the same | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Chao-Wen Shih | 2021-07-06 |
| 11024605 | Integrated circuit package and method | Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu | 2021-06-01 |
| 10978410 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2021-04-13 |
| 10957610 | Integrated circuit component and package structure having the same | Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen | 2021-03-23 |
| 10950576 | Package structure | Hsien-Wei Chen, Jiun-Heng Wang, Ming-Fa Chen | 2021-03-16 |