Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056438 | Semiconductor packages and method of forming the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-06 |
| 11024605 | Integrated circuit package and method | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh | 2021-06-01 |
| 11004809 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2021-05-11 |
| 10937719 | Package structure and method of fabricating the same | Yung-Ping Chiang, Chao-Wen Shih, Min-Chien Hsiao, Shou-Zen Chang, Yi-Che Chiang | 2021-03-02 |