Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127708 | Package structure and method of manufacturing the same | Ming-Kai Liu, Han-Ping Pu, Ting-Chu Ko, Chang-Wen Huang, Yu-Sheng Hsieh | 2021-09-21 |
| 11075159 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang +1 more | 2021-07-27 |
| 11004809 | Chip package with antenna element | Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2021-05-11 |
| 10978782 | Semiconductor packages and manufacturing methods thereof | Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2021-04-13 |
| 10937719 | Package structure and method of fabricating the same | Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Shou-Zen Chang, Yi-Che Chiang | 2021-03-02 |