Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127708 | Package structure and method of manufacturing the same | Ming-Kai Liu, Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Yu-Sheng Hsieh | 2021-09-21 |
| 11075159 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang +1 more | 2021-07-27 |