Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189603 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Der-Chyang Yeh | 2021-11-30 |
| 11145595 | Integrated fan-out package with antenna components and manufacturing method thereof | Chun-Lin Lu, Kai-Chiang Wu, Nan-Chin Chuang | 2021-10-12 |
| 11127708 | Package structure and method of manufacturing the same | Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2021-09-21 |
| 11075159 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2021-07-27 |
| 11004810 | Semiconductor package structure | Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Nan-Chin Chuang | 2021-05-11 |
| 10937734 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2021-03-02 |