Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205636 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2021-12-21 |
| 11145639 | Semiconductor package and manufacturing method thereof | Jung Wei Cheng, Chien-Hsun Lee, Chi-Yang Yu, Hao-Cheng Hou, Tsung-Ding Wang | 2021-10-12 |
| 11018113 | Memory module, semiconductor package including the same, and manufacturing method thereof | Lipu Kris Chuang, Chung-Hao Tsai, Yi-Che Chiang, Chien-Chang Lin | 2021-05-25 |
| 11004812 | Package structure and method of forming the same | Tuan-Yu Hung, Hung-Jui Kuo, Ming-Che Ho, Tzu-Yun Huang, Yen-Fu Su | 2021-05-11 |
| 10937734 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hao-Yi Tsai, Sen-Kuei Hsu | 2021-03-02 |