Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018113 | Memory module, semiconductor package including the same, and manufacturing method thereof | Lipu Kris Chuang, Chung-Hao Tsai, Hsin-Yu Pan, Chien-Chang Lin | 2021-05-25 |
| 11004809 | Chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2021-05-11 |
| 10937719 | Package structure and method of fabricating the same | Yung-Ping Chiang, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Shou-Zen Chang | 2021-03-02 |