Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205636 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Tin-Hao Kuo | 2021-12-21 |
| 11018113 | Memory module, semiconductor package including the same, and manufacturing method thereof | Chung-Hao Tsai, Hsin-Yu Pan, Yi-Che Chiang, Chien-Chang Lin | 2021-05-25 |