Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205636 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2021-12-21 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2021-12-07 |
| 11171016 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2021-11-09 |
| 11158555 | Package structure having sensor die with touch sensing electrode, and method of fabricating the same | Ting-Ting Kuo, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Chih-Hsuan Tai +1 more | 2021-10-26 |
| 11018086 | Passive devices in package-on-package structures and methods for forming the same | Chen-Shien Chen | 2021-05-25 |
| 11010580 | Fingerprint sensor in InFO structure and formation method | Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2021-05-18 |
| 10964610 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2021-03-30 |
| 10937718 | Package structures and method of forming the same | Chen-Hua Yu, Hao-Yi Tsai, Yu-Feng Chen | 2021-03-02 |