Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152273 | Conductive structures and redistribution circuit structures | Shang-Yun Tu, Sheng-Yu Wu, Ching-Hui Chen | 2021-10-19 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2021-09-28 |
| 11101192 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Yen-Chang Hu | 2021-08-24 |
| 10978433 | Package-on-package (PoP) device with integrated passive device in a via | Chen-Shien Chen | 2021-04-13 |
| 10964610 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2021-03-30 |