Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158576 | Package structure having redistribution layer structures | Chih-Hao Chang, Hao-Yi Tsai, Tin-Hao Kuo | 2021-10-26 |
| 11133269 | Semiconductor package and manufacturing method thereof | Chun-Ti Lu, Hao-Yi Tsai, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang | 2021-09-28 |
| 11107772 | Semiconductor package and method of manufacturing semiconductor package | Hsien-Ming Tu, Hao-Yi Tsai, Tin-Hao Kuo | 2021-08-31 |
| 11101192 | Wafer level embedded heat spreader | Wei Sen Chang, Yen-Chang Hu, Ching-Wen Hsiao | 2021-08-24 |
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2021-08-10 |
| 11004786 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2021-05-11 |