Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133269 | Semiconductor package and manufacturing method thereof | Chun-Ti Lu, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin | 2021-09-28 |
| 11075176 | Semiconductor device and method | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2021-07-27 |
| 10971477 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-06 |
| 10950519 | Integrated circuit package and method | Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2021-03-16 |