Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133269 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2021-09-28 |
CL
Chun-Ti Lu
Overall (2021): #498,085 of 548,734Top 95%
1
Patents 2021