Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189743 | Single photon avalanche diode | Chia-Yu Wei, Yu-Ting Kao, Wen-I Hsu, Hsun-Ying Huang, Kuo-Cheng Lee +1 more | 2021-11-30 |
| 11183523 | CMOS image sensor having indented photodiode structure | Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Hsun-Ying Huang +1 more | 2021-11-23 |
| 11152417 | Anchor structures and methods for uniform wafer planarization and bonding | Chia-Yu Wei, Cheng-Yuan Li, Hsin-Chi Chen, Kuo-Cheng Lee, Hsun-Ying Huang | 2021-10-19 |
| 11133269 | Semiconductor package and manufacturing method thereof | Chun-Ti Lu, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tzu-Sung Huang | 2021-09-28 |
| 11018179 | Semiconductor structure | Chia-Yu Wei, Chin-Hsun Hsiao, Yi-Hsing Chu, Yung-Lung Hsu, Hsin-Chi Chen | 2021-05-25 |
| 11004811 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2021-05-11 |
| 10985114 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2021-04-20 |
| 10971477 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-06 |
| 10950519 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2021-03-16 |
| 10943942 | Image sensor device and method of forming the same | Chia-Yu Wei, Kuo-Cheng Lee, Hsun-Ying Huang, Hsin-Chi Chen | 2021-03-09 |