Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177228 | Semiconductor device and bump formation process | Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2021-11-16 |
| 11152273 | Conductive structures and redistribution circuit structures | Shang-Yun Tu, Ching-Wen Hsiao, Ching-Hui Chen | 2021-10-19 |
| 11043462 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2021-06-22 |
| 10985114 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2021-04-20 |