Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177228 | Semiconductor device and bump formation process | Sheng-Yu Wu, Ching-Hui Chen, Mirng-Ji Lii, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2021-11-16 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |