Issued Patents 2021
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211261 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo +1 more | 2021-12-28 |
| 11177355 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu, Min-Chien Hsiao +1 more | 2021-11-16 |
| 11177228 | Semiconductor device and bump formation process | Sheng-Yu Wu, Ching-Hui Chen, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2021-11-16 |
| 11158614 | Thermal performance structure for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee | 2021-10-26 |
| 11152344 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee, Jiun Yi Wu | 2021-10-19 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Chung-Shi Liu, Chien Ling Hwang +2 more | 2021-09-28 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2021-08-24 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng +4 more | 2021-07-27 |
| 11069573 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee, Jiun Yi Wu | 2021-07-20 |
| 11024593 | Metal bumps and method forming same | Ming-Da Cheng, Yung-Ching Chao, Chun-Kai Tzeng, Cheng-Jen Lin, Chin Wei Kang +1 more | 2021-06-01 |
| 11018065 | Semiconductor device structure with magnetic element in testing region | Mill-Jer Wang, Tang-Jung Chiu, Chi-Chang Lai, Chia-Heng Tsai, Weii LIAO | 2021-05-25 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin +3 more | 2021-05-11 |
| 10985124 | Semiconductor structure and manufacturing method thereof | Kuo-Chin Chang, Yen-Kun Lai, Kuo-Ching Hsu | 2021-04-20 |
| 10910466 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Yung-Ching Chao, Ming-Da Cheng | 2021-02-02 |