Issued Patents 2021
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177218 | Package including metallic bolstering pattern and manufacturing method of the package | Jiun Yi Wu, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-16 |
| 11158614 | Thermal performance structure for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii | 2021-10-26 |
| 11152344 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2021-10-19 |
| 11145639 | Semiconductor package and manufacturing method thereof | Jung Wei Cheng, Chi-Yang Yu, Hao-Cheng Hou, Hsin-Yu Pan, Tsung-Ding Wang | 2021-10-12 |
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2021-10-05 |
| 11127644 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng | 2021-09-21 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2021-08-24 |
| 11088069 | Semiconductor package and semiconductor device | Hao-Cheng Hou, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang | 2021-08-10 |
| 11069573 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2021-07-20 |
| 11006532 | Circuit carrier and manifacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2021-05-11 |
| 10957672 | Package structure and method of manufacturing the same | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2021-03-23 |
| 10937721 | Semiconductor structure | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2021-03-02 |
| 10916529 | Electronics card including multi-chip module | Chen-Hua Yu, Jiun Yi Wu | 2021-02-09 |
| 10916519 | Method for manufacturing semiconductor package with connection structures including via groups | Chien-Hsun Chen, Jiun Yi Wu, Chung-Shi Liu | 2021-02-09 |
| 10888000 | Manufacturing method of circuit board and of semiconductor device including the same | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2021-01-05 |