Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng | 2021-10-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng | 2021-10-05 |