Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158614 | Thermal performance structure for semiconductor packages and method of forming same | Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee | 2021-10-26 |
| 11145639 | Semiconductor package and manufacturing method thereof | Chien-Hsun Lee, Chi-Yang Yu, Hao-Cheng Hou, Hsin-Yu Pan, Tsung-Ding Wang | 2021-10-12 |
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2021-10-05 |
| 11127644 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Chien-Hsun Lee | 2021-09-21 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin +3 more | 2021-08-24 |
| 11088069 | Semiconductor package and semiconductor device | Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu, Tsung-Ding Wang | 2021-08-10 |