Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127644 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Yu-Min Liang, Jung Wei Cheng, Chien-Hsun Lee | 2021-09-21 |
HC
Hai-Ming Chen
Overall (2021): #441,562 of 548,734Top 85%
1
Patents 2021