Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145639 | Semiconductor package and manufacturing method thereof | Jung Wei Cheng, Chien-Hsun Lee, Hao-Cheng Hou, Hsin-Yu Pan, Tsung-Ding Wang | 2021-10-12 |
| 11127644 | Planarization of semiconductor packages and structures resulting therefrom | Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng, Chien-Hsun Lee | 2021-09-21 |
| 11011431 | Semiconductor structure and manufacturing method thereof | Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng, Kuan-Lin Ho | 2021-05-18 |
| 10957672 | Package structure and method of manufacturing the same | Chin-Liang Chen, Chien-Hsun Lee, Kuan-Lin Ho, Yu-Min Liang | 2021-03-23 |