Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195788 | Hybrid dielectric scheme in packages | Jiun Yi Wu, Chen-Hua Yu | 2021-12-07 |
| 11177218 | Package including metallic bolstering pattern and manufacturing method of the package | Jiun Yi Wu, Chien-Hsun Lee, Shou-Yi Wang | 2021-11-16 |
| 11171090 | Semiconductor device and method of manufacture | Jiun Yi Wu, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Shou-Yi Wang | 2021-11-09 |
| 11088059 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the same | Jiun Yi Wu, Shou-Yi Wang | 2021-08-10 |
| 11062998 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Shih-Ya Huang | 2021-07-13 |
| 10971446 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2021-04-06 |
| 10916519 | Method for manufacturing semiconductor package with connection structures including via groups | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2021-02-09 |