Issued Patents 2021
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211336 | Integrated fan-out package and method for fabricating the same | Chen-Hua Yu, Chun-Hui Yu | 2021-12-28 |
| 11195816 | Integrated circuit packages comprising a plurality of redistribution structures and methods of forming the same | Chen-Hua Yu | 2021-12-07 |
| 11177192 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2021-11-16 |
| 11177434 | Chip package | Chen-Hua Yu | 2021-11-16 |
| 11171076 | Compute-in-memory packages and methods forming the same | Chen-Hua Yu | 2021-11-09 |
| 11152344 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2021-10-19 |
| 11139223 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung | 2021-10-05 |
| 11088058 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Ying-Hao Kuo | 2021-08-10 |
| 11075145 | Semiconductor device including through die via and manufacturing method thereof | Chen-Hua Yu | 2021-07-27 |
| 11075184 | Semiconductor package and method of fabricating semiconductor package | Chen-Hua Yu, Chun-Hui Yu | 2021-07-27 |
| 11069573 | Wafer level package structure and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2021-07-20 |
| 11066297 | MEMS packages and methods of manufacture thereof | Chen-Hua Yu | 2021-07-20 |
| 11069636 | Package structure and method of forming the same | Chen-Hua Yu, Chun-Hui Yu | 2021-07-20 |
| 11062975 | Package structures | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2021-07-13 |
| 11031344 | Package having redistribution layer structure with protective layer and method of fabricating the same | Chen-Hua Yu, Chun-Hui Yu | 2021-06-08 |
| 11018095 | Semiconductor structure | Chen-Hua Yu, Jui-Pin Hung | 2021-05-25 |
| 11004799 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Chen-Hua Yu | 2021-05-11 |
| 10985101 | Semiconductor package and manufacturing method thereof | Yu-Chia Lai, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-04-20 |
| 10971462 | Package structure and manufacturing method thereof | Chen-Hua Yu | 2021-04-06 |
| 10971475 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2021-04-06 |
| 10964666 | Chip on package structure and method | Chen-Hua Yu, Der-Chyang Yeh, Jui-Pin Hung | 2021-03-30 |
| 10957559 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2021-03-23 |
| 10950554 | Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same | Chen-Hua Yu, Chun-Hui Yu | 2021-03-16 |