Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088058 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Kuo-Chung Yee | 2021-08-10 |
| 11060977 | Bio-chip package with waveguide integrated spectrometer | Jui Hsieh Lai | 2021-07-13 |
| 10983278 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao | 2021-04-20 |
| 10957559 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2021-03-23 |