Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171041 | Etch damage and ESL free dual damascene metal interconnect | Sunil Kumar Singh, Chung-Ju Lee | 2021-11-09 |
| 11125940 | Method of fabrication polymer waveguide | Chun-Hao Tseng, Wan-Yu Lee, Hai-Ching Chen | 2021-09-21 |
| 11087994 | Via connection to a partially filled trench | Shih-Ming Chang, Chih-Ming Lai, Ru-Gun Liu, Tsai-Sheng Gau, Chung-Ju Lee +1 more | 2021-08-10 |
| 11062901 | Low-k dielectric and processes for forming same | Chia-Cheng Chou, Po-Cheng Shih, Li Chun Te | 2021-07-13 |
| 11049811 | Forming interlayer dielectric material by spin-on metal oxide deposition | Chi-Lin Teng, Jung-Hsun Tsai, Kai-Fang Cheng, Hsin-Yen Huang, Hai-Ching Chen | 2021-06-29 |
| 11011421 | Semiconductor device having voids and method of forming same | Yung-Hsu Wu, Chien-Hua Huang, Chung-Ju Lee, Shau-Lin Shue | 2021-05-18 |
| 10983278 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Ying-Hao Kuo, Kai-Fang Cheng, Hai-Ching Chen | 2021-04-20 |
| 10943867 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Hai-Ching Chen | 2021-03-09 |
| 10943820 | Gap-fill method having improved gap-fill capability | Wan-Yi Kao, Wei LI, Chung-Chi Ko, Yu-Cheng Shiau, Han-Sheng Weng +1 more | 2021-03-09 |
| 10910216 | Low-k dielectric and processes for forming same | Chia-Cheng Chou, Li Chun Te, Po-Cheng Shih | 2021-02-02 |