WL

Wei LI

TSMC: 2 patents #1,187 of 3,494Top 35%
📍 Singapore, SG: #171 of 1,679 inventorsTop 15%
Overall (2021): #100,419 of 548,734Top 20%
2
Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11075123 Method for forming isolation structure having improved gap-fill capability Wan-Yi Kao, Chung-Chi Ko 2021-07-27
10943820 Gap-fill method having improved gap-fill capability Wan-Yi Kao, Chung-Chi Ko, Yu-Cheng Shiau, Han-Sheng Weng, Chih-Tang Peng +1 more 2021-03-09