Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211243 | Method of filling gaps with carbon and nitrogen doped film | Chung-Chi Ko | 2021-12-28 |
| 11075123 | Method for forming isolation structure having improved gap-fill capability | Chung-Chi Ko, Wei LI | 2021-07-27 |
| 11069812 | Fin field-effect transistor device and method of forming the same | Chung-Chi Ko | 2021-07-20 |
| 10971589 | Low-k feature formation processes and structures formed thereby | Chung-Chi Ko | 2021-04-06 |
| 10950431 | Low-k feature formation processes and structures formed thereby | Chung-Chi Ko, Li Chun Te, Hsiang-Wei Lin, Te-En Cheng, Wei-Ken Lin +2 more | 2021-03-16 |
| 10943820 | Gap-fill method having improved gap-fill capability | Wei LI, Chung-Chi Ko, Yu-Cheng Shiau, Han-Sheng Weng, Chih-Tang Peng +1 more | 2021-03-09 |