Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211243 | Method of filling gaps with carbon and nitrogen doped film | Wan-Yi Kao | 2021-12-28 |
| 11075123 | Method for forming isolation structure having improved gap-fill capability | Wan-Yi Kao, Wei LI | 2021-07-27 |
| 11069812 | Fin field-effect transistor device and method of forming the same | Wan-Yi Kao | 2021-07-20 |
| 11049763 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Jung-Hau Shiu, Chia-Cheng Chou, Tze-Liang Lee, Chih-Hao Chen +1 more | 2021-06-29 |
| 11024550 | Semiconductor device and method | Shu Ling Liao | 2021-06-01 |
| 10971589 | Low-k feature formation processes and structures formed thereby | Wan-Yi Kao | 2021-04-06 |
| 10957543 | Device and method of dielectric layer | Yu-Yun Peng, Keng-Chu Lin | 2021-03-23 |
| 10950431 | Low-k feature formation processes and structures formed thereby | Wan-Yi Kao, Li Chun Te, Hsiang-Wei Lin, Te-En Cheng, Wei-Ken Lin +2 more | 2021-03-16 |
| 10943820 | Gap-fill method having improved gap-fill capability | Wan-Yi Kao, Wei LI, Yu-Cheng Shiau, Han-Sheng Weng, Chih-Tang Peng +1 more | 2021-03-09 |