HL

Hsiang-Wei Lin

TSMC: 4 patents #645 of 3,494Top 20%
📍 New Taipei, TW: #117 of 1,901 inventorsTop 7%
Overall (2021): #49,013 of 548,734Top 9%
4
Patents 2021

Issued Patents 2021

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
11011414 Multi-barrier deposition for air gap formation 2021-05-18
10964626 Semiconductor structure and method of making the same Yu-Ting Huang 2021-03-30
10950431 Low-k feature formation processes and structures formed thereby Wan-Yi Kao, Chung-Chi Ko, Li Chun Te, Te-En Cheng, Wei-Ken Lin +2 more 2021-03-16
10943868 Structure for interconnection 2021-03-09