Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11087994 | Via connection to a partially filled trench | Shih-Ming Chang, Chih-Ming Lai, Ru-Gun Liu, Chung-Ju Lee, Tien-I Bao +1 more | 2021-08-10 |
| 10930505 | Methods for integrated circuit design and fabrication | Tsong-Hua Ou, Ken-Hsien Hsieh, Shih-Ming Chang, Wen-Chun Huang, Chih-Ming Lai +1 more | 2021-02-23 |