Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211448 | Capacitor structure with MIM layer over metal pillars | Eswar Ramanathan | 2021-12-28 |
| 11171041 | Etch damage and ESL free dual damascene metal interconnect | Chung-Ju Lee, Tien-I Bao | 2021-11-09 |
| 11107880 | Capacitor structure for integrated circuit, and related methods | Dewei Xu, Siva R. Dangeti, Seung Yeop Kook | 2021-08-31 |
| 11094585 | Methods of forming a conductive contact structure to a top electrode of an embedded memory device on an IC product and a corresponding IC product | Xuan Anh Tran, Eswar Ramanathan, Suryanarayana Kalaga, Suresh Kumar Regonda, Juan Boon Tan | 2021-08-17 |
| 10886287 | Multiple-time programmable (MTP) memory device with a wrap-around control gate | Xuan Anh Tran, Shyue Seng Tan | 2021-01-05 |