Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205478 | Memory device and a method for forming the memory device | Lanxiang Wang, Shyue Seng Tan, Eng Huat Toh | 2021-12-21 |
| 11127459 | Memory devices and methods of forming the same | Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Yi Jiang, Kai Kang | 2021-09-21 |
| 11127784 | Integrated circuits with embedded memory structures and methods for fabricating the same | Curtis Chun-I Hsieh, Wanbing Yi, Yi Jiang | 2021-09-21 |
| 11094585 | Methods of forming a conductive contact structure to a top electrode of an embedded memory device on an IC product and a corresponding IC product | Xuan Anh Tran, Eswar Ramanathan, Sunil Kumar Singh, Suryanarayana Kalaga, Suresh Kumar Regonda | 2021-08-17 |
| 11081523 | Memory devices and methods of forming memory devices | Curtis Chun-I Hsieh, Wei-Hui Hsu, Yi Jiang, Wanbing Yi | 2021-08-03 |
| 11031251 | Self-aligned planarization of low-k dielectrics and method for producing the same | Curtis Chun-I Hsieh, Wanbing Yi, Yi Jiang, Zhehui Wang | 2021-06-08 |
| 11018093 | Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same | Bharat Bhushan, Boo Yang Jung, Wanbing Yi, Danny Pak-Chum Shum | 2021-05-25 |
| 10892239 | Bond pad reliability of semiconductor devices | Ramasamy Chockalingam, Ian Melville | 2021-01-12 |