Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11150404 | Photonic package and method forming same | Sung-Hui Huang, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2021-10-19 |
| 11060977 | Bio-chip package with waveguide integrated spectrometer | Ying-Hao Kuo | 2021-07-13 |
| 10985125 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2021-04-20 |
| 10948668 | Package structure for optical fiber and method for forming the same | Sung-Hui Huang, Shang-Yun Hou | 2021-03-16 |