Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201097 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Ying-Ching Shih +1 more | 2021-12-14 |
| 11156772 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Shang-Yun Hou +1 more | 2021-10-26 |
| 11150404 | Photonic package and method forming same | Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2021-10-19 |
| 11121050 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Ying-Ching Shih +1 more | 2021-09-14 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2021-08-24 |
| 11101236 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2021-08-24 |
| 10985125 | Chip package structure | Kuan-Yu Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu, Shang-Yun Hou +4 more | 2021-04-20 |
| 10978346 | Conductive vias in semiconductor packages and methods of forming same | Hung-Pin Chang, Sao-Ling Chiu, Shang-Yun Hou, Wan-Yu Lee | 2021-04-13 |
| 10948668 | Package structure for optical fiber and method for forming the same | Jui Hsieh Lai, Shang-Yun Hou | 2021-03-16 |
| 10886147 | Package structure and method for forming the same | Kuan-Yu Huang, Shang-Yun Hou | 2021-01-05 |