Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201097 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-12-14 |
| 11121050 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-09-14 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2021-07-27 |
| 11024616 | Package structure and method of manufacturing the same | Yu-Wei Chen, Li-Chung Kuo, Szu-Wei Lu, Ying-Ching Shih, Kuan-Yu Huang | 2021-06-01 |