Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101236 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen | 2021-08-24 |
| 11102058 | Method and system for network function recovery notification | Suzann Hua, Emerando M. Delos Reyes, Parry Cornell Booker | 2021-08-24 |
| 10985125 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2021-04-20 |