Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985125 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Yi-Wei Liu, Shang-Yun Hou +4 more | 2021-04-20 |
LC
Leu-Jen Chen
Overall (2021): #363,382 of 548,734Top 70%
1
Patents 2021