Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183487 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +2 more | 2021-11-23 |
| 11164819 | Semiconductor package and manufacturing method thereof | Ying-Cheng Tseng, Hao-Yi Tsai, Tin-Hao Kuo, Chia-Hung Liu | 2021-11-02 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Tin-Hao Kuo, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2021-08-31 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chih-Hsuan Tai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo, Yu-Chih Huang +4 more | 2021-06-29 |
| 11011501 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +2 more | 2021-05-18 |
| 10985101 | Semiconductor package and manufacturing method thereof | Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Kuo-Chung Yee +1 more | 2021-04-20 |
| 10978382 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-04-13 |