Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158555 | Package structure having sensor die with touch sensing electrode, and method of fabricating the same | Ting-Ting Kuo, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2021-10-26 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo, Yu-Chih Huang +4 more | 2021-06-29 |
| 11011501 | Package structure, package-on-package structure and method of fabricating the same | Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu +2 more | 2021-05-18 |
| 11004786 | Package structure and method of forming the same | Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2021-05-11 |