Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152319 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Kai Jun Zhan | 2021-10-19 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2021-08-24 |
| 11094655 | Semiconductor structure and method for forming the same | Wen-Hsiung Lu, Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Cheng-Jen Lin +2 more | 2021-08-17 |
| 11024593 | Metal bumps and method forming same | Ming-Da Cheng, Yung-Ching Chao, Chun-Kai Tzeng, Cheng-Jen Lin, Yu-Feng Chen +1 more | 2021-06-01 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Kai Jun Zhan, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2021-05-11 |