Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152319 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang | 2021-10-19 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Chin Wei Kang, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2021-08-24 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2021-05-11 |