Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177137 | Wafer etching process and methods thereof | Wen-Hsiung Lu, Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Hsu-Lun Liu | 2021-11-16 |
| 11152319 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2021-10-19 |
| 11101233 | Semiconductor device and method for forming the same | Chin Wei Kang, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2021-08-24 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2021-05-11 |