Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Hao-Yi Tsai +2 more | 2021-12-07 |
| 11171016 | Semiconductor package and manufacturing process thereof | Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2021-11-09 |
| 11087820 | Systems and methods for plate voltage regulation during memory array access | Byung S. Moon, Myung-Ho Bae, Harish N. Venkata | 2021-08-10 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Cheng-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng, Kuo-Ching Hsu +4 more | 2021-07-27 |
| 11024593 | Metal bumps and method forming same | Ming-Da Cheng, Yung-Ching Chao, Chun-Kai Tzeng, Cheng-Jen Lin, Chin Wei Kang +1 more | 2021-06-01 |
| 11010580 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2021-05-18 |
| 10985114 | Scheme for connector site spacing and resulting structures | Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2021-04-20 |
| 10937718 | Package structures and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai | 2021-03-02 |