Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171016 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2021-11-09 |
| 11158775 | Semiconductor device and method | Chen-Hua Yu, Keng-Han Lin, Hung-Jui Kuo | 2021-10-26 |
| 11127701 | Method of manufacturing intergrated fan-out package with redistribution structure | Hung-Jui Kuo, Jyun-Siang Peng | 2021-09-21 |
| 11121106 | Integrated circuit package and method | Hung-Jui Kuo, Chia-Wei Wang, Yu-Tzu Chang | 2021-09-14 |
| 11088068 | Semiconductor packages and methods of manufacturing the same | Hung-Jui Kuo, Keng-Han Lin, Jyun-Siang Peng | 2021-08-10 |
| 10978412 | Manufacturing method of package structure | Hung-Jui Kuo, Tsao-Lun Chang, Tai-Min Chang | 2021-04-13 |
| 10971442 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Yun Chen Hsieh, Hung-Jui Kuo | 2021-04-06 |
| 10964591 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hung-Jui Kuo, Chen-Hua Yu | 2021-03-30 |
| 10892228 | Method of manufacturing conductive feature and method of manufacturing package | Hung-Jui Kuo, Yun Chen Hsieh | 2021-01-12 |
| 10886231 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Yun Chen Hsieh, Chen-Hua Yu | 2021-01-05 |