Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971442 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo | 2021-04-06 |
| 10964591 | Processes for reducing leakage and improving adhesion | Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu | 2021-03-30 |
| 10892228 | Method of manufacturing conductive feature and method of manufacturing package | Hui-Jung Tsai, Hung-Jui Kuo | 2021-01-12 |
| 10886231 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Hui-Jung Tsai, Chen-Hua Yu | 2021-01-05 |