Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127701 | Method of manufacturing intergrated fan-out package with redistribution structure | Hung-Jui Kuo, Hui-Jung Tsai | 2021-09-21 |
| 11088068 | Semiconductor packages and methods of manufacturing the same | Hung-Jui Kuo, Hui-Jung Tsai, Keng-Han Lin | 2021-08-10 |