Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211261 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2021-12-28 |
| 11056412 | Semiconductor package and manufacturing method thereof | Shih-Hao Tseng, Hung-Jui Kuo, Chia-Hung Liu | 2021-07-06 |
| 11031342 | Semiconductor package and method | Shih-Hao Tseng, Hung-Jui Kuo | 2021-06-08 |
| 11024048 | Method, image processing device, and system for generating disparity map | Chong Li | 2021-06-01 |
| 11024581 | Semiconductor packages and methods of manufacturing the same | Yi-Wen Wu, Hung-Jui Kuo | 2021-06-01 |
| 11018083 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Hung-Jui Kuo, Kai-Chiang Wu | 2021-05-25 |
| 11004812 | Package structure and method of forming the same | Tuan-Yu Hung, Hung-Jui Kuo, Hsin-Yu Pan, Tzu-Yun Huang, Yen-Fu Su | 2021-05-11 |
| 10985116 | Semiconductor package and method of forming the same | Ching-Wen Chen, Hung-Jui Kuo | 2021-04-20 |
| 10957645 | Package structure having conductive patterns with crystal grains copper columnar shape and method manufacturing the same | Yu-Ming Lee, Chiang-Hao Lee, Hung-Jui Kuo | 2021-03-23 |
| 10950519 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2021-03-16 |
| 10930586 | Integrated fan-out package and method of fabricating the same | Yi-Wen Wu, Hung-Jui Kuo | 2021-02-23 |