YS

Yen-Fu Su

TSMC: 1 patents #1,794 of 3,494Top 55%
Overall (2021): #203,216 of 548,734Top 40%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11004812 Package structure and method of forming the same Tuan-Yu Hung, Hung-Jui Kuo, Hsin-Yu Pan, Ming-Che Ho, Tzu-Yun Huang 2021-05-11